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Open-Silicon Integrates 50 DesignWare Interface and Analog IP Products with 100 Percent Silicon Success

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High-Quality, Fully Verified IP and Longstanding Relationship Between the Two Companies Accelerates Time-to-Market for Open-Silicon’s Customers

MOUNTAIN VIEW, Calif. – July 7, 2010 — Synopsys, Inc. (Nasdaq:SNPS), a world leader in software and IP for semiconductor design, verification and manufacturing, today announced that Open-Silicon , a leading system-on-chip (SoC) design and semiconductor manufacturing company, has licensed and integrated 50 high-speed DesignWare® IP products into customers’ chips with 100 percent first-pass silicon success. The IP products include complete solutions consisting of configurable digital controllers, PHYs which support leading process technologies from 180 to 28 nanometers, verification IP, as well as analog front ends and data converters. In addition to integrating many of Synopsys’ silicon-proven interface and analog IP products, Open-Silicon has incorporated building block and infrastructure IP from Synopsys’ DesignWare Library into hundreds of designs. By accessing a broad range of pre-verified IP solutions from a trusted vendor, Open-Silicon has been able to consistently reduce integration and verification risk and shorten development cycles for their complex designs in a wide range of applications such as home networking, enterprise network processors, wireless base-stations, storage controllers and test equipment.

“Our customers look to us to execute complex interfaces with first time silicon success, including physical design, package design, and test engineering,” said Taher Madraswala, Vice President of Engineering at Open-Silicon.  “Our 100 percent success rate when using DesignWare IP is a reflection of Open-Silicon’s IP integration capability, our tight technical relationship with Synopsys’ engineers, and the high quality of Synopsys’ complete solutions of silicon-proven DesignWare IP.”

As one of the initial members of the Synopsys IP OEM Partner Program, Open-Silicon has access to the entire Synopsys portfolio of interface and analog IP solutions. As companies increasingly turn to leading SoC design and semiconductor manufacturing vendors like Open-Silicon to help build their complex SoC designs, Synopsys is proactively partnering with these vendors to provide silicon-proven IP solutions, expert technical support and comprehensive documentation to mitigate project risks. Synopsys and Open-Silicon provide customers with high-quality IP and design services that help them bring their products to market faster and with more differentiated features.

“For more than 15 years, Synopsys has been providing SoC designers with a broad portfolio of high-quality, silicon-proven IP solutions consisting of digital controllers, PHYs and VIP that reduce integration risk and development cost and speed time-to-market for SoC designs,” said John Koeter, Vice President of Marketing for the Solutions Group at Synopsys. “As one of the industry’s top fabless ASIC companies, Open-Silicon is focused on customer service, low cost, design schedules and first-time correct silicon. Our OEM partnership with Open-Silicon enables a larger customer base to access pre-qualified DesignWare IP allowing them to reduce development costs and risk.”

About DesignWare IP
Synopsys is a leading provider of high-quality, silicon-proven interface and analog IP solutions for system-on-chip designs. Synopsys’ broad IP portfolio delivers complete connectivity IP solutions consisting of controllers, PHY and verification IP for widely used protocols such as USB, PCI Express, DDR, SATA, Ethernet, HDMI and MIPI IP including 3G DigRF, CSI-2 and D-PHY. The analog IP family includes Analog-to-Digital Converters, Digital-to-Analog Converters, Audio Codecs, Video Analog Front Ends, Touch Screen Controllers and more. In addition, Synopsys offers SystemC™ transaction-level models to build virtual platforms for rapid, pre-silicon development of software. With a robust IP development methodology, extensive investment in quality and comprehensive technical support, Synopsys enables designers to accelerate time-to-market and reduce integration risk. For more information on DesignWare IP, visit: http://www.synopsys.com/designware <http://www.synopsys.com/designware> . Follow us on Twitter at http://twitter.com/designware_ip. 

 
About Synopsys
Synopsys, Inc. (Nasdaq:SNPS) is a world leader in electronic design automation (EDA), supplying the global electronics market with the software, intellectual property (IP) and services used in semiconductor design, verification and manufacturing. Synopsys’ comprehensive, integrated portfolio of implementation, verification, IP, manufacturing and field-programmable gate array (FPGA) solutions helps address the key challenges designers and manufacturers face today, such as power and yield management, software-to-silicon verification and time-to-results. These technology-leading solutions help give Synopsys customers a competitive edge in bringing the best products to market quickly while reducing costs and schedule risk. Synopsys is headquartered in Mountain View, California, and has more than 65 offices located throughout North America, Europe, Japan, Asia and India. Visit Synopsys online at http://www.synopsys.com/ <http://www.synopsys.com/> .

About Open-Silicon, Inc.
Open-Silicon, Inc. is a leading semiconductor company focused on SoC realization for traditional ASIC, develop-to-spec, and derivative ICs. Open-Silicon’s OpenModel <http://open-silicon.com/asic-design/openmodel> brings together Open-Silicon’s engineering technology and high-quality manufacturing services with one of the broadest partner ecosystems for IC development, spanning IC design, open market IP integration, wafer fabrication, and assembly/test services. Open-Silicon received the Global Semiconductor Alliance (GSA) award <http://www.gsaglobal.org/awardsdinner/2009/awards.asp>  for Most Respected Private Semiconductor Company in 2008 and 2009. For more information, visit Open-Silicon’s website at www.open-silicon.com <http://www.open-silicon.com>  or call 408-240-5700.

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Synopsys and DesignWare are registered trademarks of Synopsys, Inc.  SystemC is a trademark of the Open SystemC Initiative and is used under license. Any other trademarks or registered trademarks mentioned in this release are the intellectual property of their respective owners.


Open-Silicon Promotes Taher Madraswala to Vice President of Engineering

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MILPITAS, Calif. – June 22, 2010: Open-Silicon, Inc., a leading ASIC design and semiconductor manufacturing company, today announced the promotion of Taher Madraswala to Vice President of Engineering. He will continue driving the on-time execution of customers’ SoC and ASIC design and development programs.

Madraswala joined Open-Silicon at its inception in 2003 and served as director of ASIC Program Management where he was instrumental in building the company’s business model, OpenMODEL™, and particularly Open-Silicon’s unique model for ASIC Program Management. His career accomplishments include more than 22 years of semiconductor engineering experience – twelve of which were devoted to designing microprocessors for Intel Corp. To date, Taher Madraswala has the distinction of being part of more than 150 tapeouts throughout his career. His focus has been on taking an architecture spec to gds2 and he has extensive experience in micro-architecture design, custom circuit design, RTL and physical design, and test among other parts of the design process.

As VP of Engineering, Madraswala will report to Shrikrishna Gokhale, Chief Operating Officer and Managing Director-India. He will be responsible for the development of strategic planning, managing the design engineering teams, and for overseeing the implementation of Open-Silicon’s proven design methodologies.

“Taher’s expertise in handling complex designs and managing Open-Silicon’s design methodology has been key to our success in providing customers with consistent delivery of reliable silicon,” said Dr. Sherwani. “His extensive experience in hands-on design and his leadership skills will be an asset in leading our design engineering teams today and as we move forward.”

Madraswala earned a Master’s degree in Computer Engineering for the University of Louisiana, Lafayette, and an undergraduate degree in Electrical Engineering from Aligarh University.

About Open-Silicon, Inc.

Open-Silicon, Inc. is a leading semiconductor company focused on SoC realization for traditional ASIC, develop-to-spec, and derivative ICs. Open-Silicon’s OpenModel brings together Open-Silicon’s engineering technology and high-quality manufacturing services with one of the broadest partner ecosystems for IC development, spanning IC design, open market IP integration, wafer fabrication, and assembly/test services. Open-Silicon received the Global Semiconductor Alliance (GSA) award for Most Respected Private Semiconductor Company in 2008 and 2009. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

Open-Silicon Reaches 50 Million SoC Chips

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High Levels of Customer Satisfaction Driving Continued Growth

Milpitas, Calif. – May 10, 2010: Open-Silicon, Inc., a leading SoC design and semiconductor manufacturing company, announced today that the Company has received orders that will push the total of chips shipped to over 50 million. This achievement, reached in only the fifth year of production shipments, highlights the strength of its business model, the OpenMODEL™, and the high quality levels achieved through Open-Silicon’s design and manufacturing efforts.

Customer shipments have averaged less than 30 defective parts per million (DPPM) shipped for the past several years. Besides nearly eliminating field returns and faulty devices shipped to customers, the focus on quality, combined with Open-Silicon’s advanced technology, has also lifted customer satisfaction levels. Since announcing 40M devices shipped in early 2009, 93% of Open-Silicon’s customers have said they would recommend Open-Silicon to others in customer satisfaction surveys. Finally, repeat customers now account for two-thirds of all designs, including Fortune 500 companies within the telecommunications, consumer, storage, and computing markets.

“To achieve such high volume chip design and manufacturing is a testament to the team and partners we have assembled, our processes we follow, and the technologies we implement. We strive to provide our customers with an easy solution to their ASIC needs, and with so many of our customers returning to us for subsequent designs, I believe we have met their needs,” said Dr. Shafy Eltoukhy, vice president of manufacturing operations, Open-Silicon.

The 50 million units reflect multiple designs with over 20M gates and processes from legacy 0.25µm to state-of-the-art 40nm. Open-Silicon also leverages the MAX technologies on more and more customer designs to enable building the best possible custom silicon. In addition to netlist handoffs, spec-to-parts and derivative handoffs offer customers new models for getting products to market. For those already in production, Open-Silicon offers cost-effective manufacturing services.

About Open-Silicon, Inc.

Open-Silicon, Inc. is a leading semiconductor company focused on SoC realization for traditional ASIC, develop-to-spec, and derivative ICs. Open-Silicon’s OpenModel brings together Open-Silicon’s engineering technology and high-quality manufacturing services with one of the broadest partner ecosystems for IC development, spanning IC design, open market IP integration, wafer fabrication, and assembly/test services. Open-Silicon received the Global Semiconductor Alliance (GSA) award for Most Respected Private Semiconductor Company in 2008 and 2009. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

Brite Semiconductor, Open-Silicon and HiSilicon Announce Silicon Success of 65nm Wireless Network Chip

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Highly Complex SoC Delivered with Short Schedule using TSMC Process

Shanghai, China – April 09, 2010: HiSilicon Technologies Co., Ltd., Brite Semiconductor (Shanghai), Inc., and Open-Silicon, Inc. today announced that the companies have completed a 65nm Wireless Network SoC design with a TSMC foundry process. The SoC achieved first pass silicon success and taped out within a short schedule requirement (four months from physical design start to tape out) to meet business conditions. The product returned from the fab and the silicon met all the performance requirements, having been tested in HiSilicon’s lab.

The telecom SoC is highly complex, containing 100M gates, more than 8 cores, an 800MHz high-speed clocking system, and 3.125G high-speed interfaces.

The Brite Semiconductor design team which organized and executed the project included experienced engineers from multiple Brite Semiconductor and Open-Silicon locations (Bangalore, Milpitas, CA, and Shanghai). Well-defined initial planning and excellent ongoing project management proved the most important factors for the success of the project within such a tight schedule.

“This 65nm project showed how Brite’s technologies and project management capabilities can be used to achieve top performance in a standard ASIC implementation,” stated Dr. Charlie Zhi, CEO and President of Brite Semiconductor (Shanghai). “Brite proved itself again by providing our customers with a predictable product completion time which improves the competitiveness of their products.”

“While there may be other similarly complex projects in North America, completing such a chip in just four months with absolute silicon success is quite rare,” said Dr. Naveed Sherwani, CEO and President of Open-Silicon. “Open-Silicon was proud to work with our partner Brite Semiconductor to demonstrate our high performance technology and to provide our custom low-cost and high-reliability ASIC design service.”

“The preciseness, cooperation and advanced design flows provided by Brite Semiconductor and Open-Silicon guaranteed the successful tape-out of this SoC design on schedule. The two companies once again demonstrated their abilities and have received accolades from both partners and colleagues in the industry,” said VP of HiSilicon, Tingbo He.

About Brite Semiconductor (Shanghai), Inc.

Brite Semiconductor is a fabless ASIC company delivering the most cost-effective, predictable and reliable custom ASIC solutions to electronics product customers worldwide. Brite Semiconductor uses proven design flows and methodology with advance design capability and provides end-to-end custom ASIC solutions based on a proven business model that provides a seamless, low-cost, low-risk alternative to traditional models for complex ASIC design and development. www.britesemi.com or call 86-21-50277866.

About HiSilicon, Inc.

HiSilicon provides ASICs and solutions for communication network and digital media. These ASICs are widely used in over 100 countries and regions around the world. In the digital media field, Hisilicon has already released the SoC and solution for network surveillance, videophone, DVB and IPTV.

With years of experience, HiSilicon has mastered the leading IC design and test technologies and constructed advanced EDA design platforms, R&D flows and processes. Moreover, HiSilicon possesses the IPRs of more than 100 types of self-developed chips, and at the same time owns over 500 patents.

HiSilicon has kept excellent strategic cooperation with partners from USA, Japan, Europe and China, thus maintaining a complete and stable network covering wafer production, encapsulation and test.

About Open-Silicon, Inc.

Open-Silicon, Inc. is a leading semiconductor company focused on setting new standards for predictable, reliable and flexible custom IC development. Open-Silicon provides leading-edge SoC and ASIC design, proven open market IP integration and high-quality silicon manufacturing services to customers worldwide. Through the MAX Technologies, Open-Silicon continues to introduce technology advantages in the areas of low-power design, high-performance processor implementation, variability management, and low-cost test that help customers increase their market success. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

Open-Silicon Increases Global Presence with Open-Silicon Japan

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Focus on unique OpenModel and low-power technologies

MILPITAS, Calif. – February 23, 2010: Open-Silicon, Inc., a leading ASIC design and semiconductor manufacturing company, announced today that it has launched Open-Silicon Japan with headquarters in the Landmark Tower, Yokohama, Japan. The company has already secured its first Japanese customer.

Open-Silicon’s expansion to Japan enables the company to support the escalating demand for low-power ICs—both next-generation ASICs and “power-down derivatives”—which are required in the mobile, consumer, networking, and server products that come from Japan. Open-Silicon offers a strong low-power capability with its PowerMAX technology, which provides low-power design techniques like back biasing, custom low power cells, and power recovery. The company also recently joined the Power Forward Initiative, a low-power industry group.

“As Japanese semiconductor companies consolidate and go to a fab-lite model for 40nm, 28nm, or 22nm, the trend is to shift to foundry-based silicon for which Open-Silicon is a great fit,” said Rick Murayama, managing director of Open-Silicon Japan. “Our predictability and reliability enable customers to enjoy the same high level of quality and service they have enjoyed from the large traditional IDMs.”

Open-Silicon attributes much of its success to the OpenMODEL™, the semiconductor industry's first end-to-end custom SoC development solution based on a revolutionary business model that provides a seamless, low-cost, and low-risk alternative to traditional models for complex ASIC design and development. Designers can choose their foundry, package supplier, and IP from any available on the open market, or they can ask Open-Silicon to propose complete solutions leveraging the best available technology. In addition, Open Silicon continues to broaden its ecosystem partnerships and expand it design capabilities. The company recently acquired Silicon Logic Engineering (SLE) to increase the front-end capabilities for designing derivative ICs, which are increasingly in demand as semiconductor companies look to maximize the returns on their initial platform IC investments.

About Open-Silicon, Inc.

Open-Silicon, Inc. is a leading semiconductor company focused on SoC realization for traditional ASIC, develop-to-spec, and derivative ICs. Open-Silicon’s OpenModel brings together Open-Silicon’s engineering technology and high-quality manufacturing services with one of the broadest partner ecosystems for IC development, spanning IC design, open market IP integration, wafer fabrication, and assembly/test services. Open-Silicon received the Global Semiconductor Alliance (GSA) award for Most Respected Private Semiconductor Company in 2008 and 2009. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

Open-Silicon and Virage Logic Partner to Deliver Silicon Proven IP for SOC Design

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Logic Back Biasing Solution and Low Power Memories Enable Ultra Low Power Design

MILPITAS and FREMONT, Calif. – February 17, 2010: Open-Silicon, Inc., a leading ASIC design and semiconductor manufacturing company, and Virage Logic (NASDAQ: VIRL), the semiconductor industry’s trusted IP partner, today announced a partnership agreement to provide customers with comprehensive design solutions including access to Virage Logic’s extensive Physical and advanced Interface intellectual property (IP) portfolio. In particular, as more and more customers develop energy efficient devices, Virage Logic’s low power IP combined with Open-Silicon’s lower power design technology enable the development of significantly lower power silicon.

“This partnership underscores our continued commitment to meet our customers’ needs for lower power, managed variability, and faster time-to-market,” said Dr. Naveed Sherwani, CEO and president of Open-Silicon. “We selected Virage Logic as our trusted IP partner because of their proven track record in providing a broad portfolio of highly differentiated IP. This offering, paired with Open-Silicon’s OpenMODEL™ proven integration capability, allows customers to achieve very high levels of performance while reducing overall system power.”

The partnership presents a well-aligned technology offering. Virage Logic, a leader in low power semiconductor IP technology, uses several advanced power management features within the SiWare™ Memory compilers and SiWare™ Logic libraries that enable customers to dramatically reduce leakage current while maximizing performance. Open-Silicon’s VariMAX back biasing technology similarly works with Virage Logic’s tapless SiWare Logic standard cell libraries to reduce leakage for the IC’s logic. By changing the amount of bias used on individual chips, VariMAX effectively tunes the silicon for optimum power and thereby boosts production yields. This latest collaboration builds on a recently announced co-developed test chip with working silicon running at 1.1GHz that was achieved using Open-Silicon’s patented CoreMAX™ performance enhancement technology and Virage Logic’s advanced SiWare Memory compilers.

“As power management and efficiency are becoming increasingly critical in a multiplicity of products and technologies, our collaboration with Open-Silicon underscores how we are working with our design ecosystem partners to help SoC designers address these challenges,” said Dr. Alex Shubat, president and CEO of Virage Logic. “Open-Silicon’s MAX Technologies working in conjunction with Virage Logic’s extensive semiconductor IP portfolio enables our mutual customers to address a broad range of SoC design requirements.”

About Virage Logic's SiWare Memory and SiWare Logic Products

The SiWare product line, first introduced in October 2007 for the 65-nanometer(nm) process and now in use by more than 20 customers on the 40nm process, has been proven to address the increasingly complex design requirements that are placed on physical IP at advanced processes. The power-optimized memories for advanced processes minimize both static and dynamic power consumption and provide optimal yields. SiWare High-Density memory compilers are optimized to generate memories with the absolute minimum area. SiWare High-Speed memory compilers are designed to help designers achieve the most aggressive critical path requirements. Compile-time options for process threshold variants, power saving modes, read and write margin extensions, ultra-low voltage operation, and innovative design for at-speed test enable SoC designers to configure optimal solutions for their specific design requirements.

All SiWare Memory compilers are fully supported by Virage Logic's STAR™ Memory System, the company's flagship embedded memory test and repair system that may be used with Virage Logic memories as well as with other commercially available or internally developed memories. For repair purposes, the STAR Memory System deploys foundry-developed eFuse for repair signature storage. The STAR Memory System employs test algorithms tailored for advanced processes for higher product reliability and accelerated time-to-yield.

The SiWare Logic product line includes yield-optimized standard cells for a wide variety of design applications at 40nm with multiple threshold process variants. SiWare Logic libraries offer three separate architectures to optimize circuits for Ultra-High-Density, High-Speed, or general use. SiWare Logic Ultra-Low-Power extension libraries also provide designers with the most advanced power management capabilities.

About Virage Logic

Virage Logic is a leading provider of semiconductor intellectual property (IP) for the design of complex integrated circuits. The company's highly differentiated product portfolio includes processor solutions, interface IP solutions, embedded SRAMs and NVMs, embedded test and yield optimization solutions, logic libraries, and memory development software. As the industry's trusted semiconductor IP partner, more than 400 foundry, IDM and fabless customers rely on Virage Logic to achieve higher performance, lower power, higher density and optimal yield, as well as shorten time-to-market and time-to-volume. For further information, visit http://www.viragelogic.com.

About Open-Silicon, Inc.

Open-Silicon, Inc. is a leading semiconductor company focused on SoC realization for traditional ASIC, develop-to-spec, and derivative ICs. Open-Silicon’s OpenModel brings together Open-Silicon’s engineering technology and high-quality manufacturing services with one of the broadest partner ecosystems for IC development, spanning IC design, open market IP integration, wafer fabrication, and assembly/test services. Open-Silicon received the Global Semiconductor Alliance (GSA) award for Most Respected Private Semiconductor Company in 2008 and 2009. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

All trademarks are the property of their respective owners and are protected herein.

Open-Silicon Joins Power Forward Initiative

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Demonstrates its Continued Efforts to Create Low-Power ASIC and SoC Designs

MILPITAS, Calif. – January 26, 2010: Open-Silicon, Inc., a leading ASIC design and semiconductor manufacturing company, announced today that it has joined the Power Forward Initiative (PFI), an industry effort sponsored by Cadence Design Systems (NASDAQ: CDNS) with the goal of enabling the design and production of more power-efficient electronic devices.

“Our customers have become very sensitive to power efficiency. Many mainstream designs, which were not traditionally power sensitive, are now paying close attention to power consumption due to exponential growth in leakage power and higher dynamic power from increasing levels of integration and performance,” said Dr. Naveed Sherwani, CEO and president of Open-Silicon. “We have demonstrated our commitment to building high-performance, low-power designs for our customers using our PowerMAX™ Technology. Now our move to join PFI reinforces our commitment to meet our customers’ needs.”

Open-Silicon’s MAX Technologies offer customers power saving advantages like back biasing, transistor transformations, and power recovery. The combination of the best low-power EDA design flows with Open-Silicon’s unique technologies allows building the best possible custom silicon. The company recently announced that Solarflare has successfully used PowerMAX in its second-generation SFC9020 Ethernet Controller with integrated 10Gb Ethernet PHY, which has been sampling to Tier1 server OEMs. This is the third generation of Solarflare silicon built by Open-Silicon, and the second designed using Open-Silicon’s PowerMAX technology to optimize the silicon for low power.

“The addition of Open-Silicon to the Power Forward Initiative demonstrates the ongoing strong industry support behind our mission,” said Neil Hand, director of low power solutions at Cadence Design Systems. “Open-Silicon’s extensive and varied design and manufacturing experience provides a unique perspective to the group and we look forward to the addition of the company.”

About Open-Silicon, Inc.

Open-Silicon, Inc. is a leading semiconductor company focused on SoC realization for traditional ASIC, develop-to-spec, and derivative ICs. Open-Silicon’s OpenModel brings together Open-Silicon’s engineering technology and high-quality manufacturing services with one of the broadest partner ecosystems for IC development, spanning IC design, open market IP integration, wafer fabrication, and assembly/test services. Open-Silicon received the Global Semiconductor Alliance (GSA) award for Most Respected Private Semiconductor Company in 2008 and 2009. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

About Power Forward Initiative

The Power Forward Initiative, which has more than 40 member companies, is an industry initiative sponsored by Cadence Design Systems which has the goal of enabling the design and production of more power-efficient electronic devices. The initiative includes companies representing a broad cross section of the design chain including system, semiconductor, foundry, IP, EDA, ASIC and design services companies. CPF was contributed by Cadence to the Si2 Low Power Coalition in December 2006; CPF is a widely-deployed low-power intent standard in the industry and available from Si2. The Initiative has also published A Practical Guide to Low-Power Design – User experience with CPF which is aimed at educating the broad design marketplace in utilizing advanced low-power design techniques. The Guide is available free of charge at www.powerforward.org.

Open-Silicon Targets Derivative IC Market with SLE Acquisition

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Open-Silicon Expands One of the Broadest Partner Ecosystems for IC Development

MILPITAS, Calif. – January 12, 2010: Open-Silicon, Inc., a leading SoC design and semiconductor manufacturing company, announced today the acquisition of Silicon Logic Engineering (SLE) to enhance the company’s derivative IC design capabilities. The SLE team, based in Eau Claire, Wis., joined Open-Silicon effective December 7, 2009.

As part of Open-Silicon, SLE will increase the front-end capabilities at the company for designing derivative ICs, which are increasingly in demand as semiconductor companies look to maximize the returns on their initial platform IC investments. Previously Open-Silicon announced successful completion of an NXP Semiconductor product development which went from spec to production, including software, within 13 months. To build the best fully custom ICs and derivatives, specific technology and market design knowledge is needed. Open-Silicon will continue using an existing network of industry-leading design services partners, combined with the SLE team, to offer customers the best fitting design solutions on the market.

SLE was founded in 1996 from senior engineers formerly with supercomputer company Cray Research. Over the past 13 years, Silicon Logic Engineering has provided the ASIC industry with architecture, RTL design, design verification, and physical design services and grown to a respected industry icon with a reputation as the premier design center for highly complex designs. With an average of more than 20 years of engineering experience on designs up to 50M+ gates, SLE’s team brings extensive technical knowledge of the computing, networking, telecommunications and military/aerospace industries.

“Companies today are looking for ways to leverage their engineering investments. The SLE team, along with the existing Open-Silicon team, provides the capability to build the derivative IC designs our customers seek,” said Dr. Naveed Sherwani, CEO and president of Open-Silicon. “With this merger, Open-Silicon has created one of the broadest partner ecosystems for IC development which includes multiple foundry, IP, and assembly/test partners to provide the best possible technologies for each IC.”

About Open-Silicon, Inc.

Open-Silicon, Inc. is a leading semiconductor company focused on SoC realization for traditional ASIC, develop-to-spec, and derivative ICs. Open-Silicon’s OpenModel™ brings together Open-Silicon’s engineering technology and high-quality manufacturing services with one of the broadest partner ecosystems for IC development, spanning IC design, open market IP integration, wafer fabrication, and assembly/test services. Open-Silicon received the Global Semiconductor Alliance (GSA) award for Most Respected Private Semiconductor Company in 2008 and 2009. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.


Open-Silicon Earns GSA’s Most Respected Private Semiconductor Company Award Two Years in a Row

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MILPITAS, Calif. – December 15, 2009: Open-Silicon, Inc., a leading ASIC design and semiconductor manufacturing company, announced today that for the second year in a row it has won the Global Semiconductor Alliance (GSA) award for the industry's "Most Respected Private Semiconductor Company."

The GSA presents this award annually to the private company most respected in terms of technology, vision and future opportunity. The demand for Open-Silicon’s develop-to-spec IC services and utilization of its MAX Technologies has put the company at the forefront of IC design. Also, teaming with industry leading IP and design services vendors has enhanced Open-Silicon’s offering, making it one of the most flexible industry partners for IC development.

“To receive one of the most prestigious awards given in our industry is a great honour and a tribute to our open market development model, the OpenMODEL™,” said Dr. Naveed Sherwani, Open-Silicon president and CEO. “We have assembled a world-class team of vendors, partners and customers that allow us to predictably and reliably deliver customized semiconductor products. As we move forward we intend to build on what has helped us achieve so much and increase our offering for our customers.”

Only two other companies have received this award more than once, NVIDIA and Cavium Networks, both of which are now public companies. The award process consists of nomination by a GSA committee of industry experts and then final selection by the semiconductor community, including semiconductor financial and industry analysts and suppliers.

GSA announced on December 14, 2009, all of the GSA Award winners. To view the complete press release visit http://www.gsaglobal.org/news/article.asp?article=2009/1214.

About Open-Silicon, Inc.

Open-Silicon, Inc. is a leading semiconductor company focused on setting new standards for predictable, reliable and flexible custom IC development. Open-Silicon provides leading-edge SoC and ASIC design, proven open market IP integration and high-quality silicon manufacturing services to customers worldwide. Through the MAX Technologies, Open-Silicon continues to introduce technology advantages in the areas of low-power design, high-performance processor implementation, variability management, and low-cost test that help customers increase their market success. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

Open-Silicon Expands Global Reach of Custom ASIC Design with PrinSipa as Sales Representative

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MILPITAS, Calif. - November 24, 2009: Open-Silicon, Inc., a leading ASIC design and semiconductor manufacturing company, announced today that due to the increasing international demand for open market IC solutions, the company has teamed with PrinSipa as Open-Silicon’s representative for the UK and Ireland. The engagement with PrinSipa will further extend the successes Open-Silicon has already seen in Europe, providing leading edge technology solutions to customers seeking high quality ASIC design support as well as develop-to-spec IC services.

Open-Silicon’s OpenMODEL™ will be a key offering for PrinSipa to extend to its customers. The OpenMODEL enables customers to utilize the best technology available on the open market. Combining the foundry that is the best match for the product type, with the world's best IP, allows designers to build the best possible custom silicon. In addition, Open-Silicon has seen a growing demand for its PowerMAX™ Technology, which is used to optimize designs for low-power, especially in the markets that PrinSipa serves, such as consumer, storage, telecommunications, and industrial.

“PrinSipa has proven market and customer knowledge and their commitment to the support of the SoC design-in process made PrinSipa the ideal representative partner. We look forward to leveraging PrinSipa’s local presence to continue the growth and success we have experienced in Europe,” said Dave Krishna, VP of worldwide sales at Open-Silicon.

David Clark, Managing Partner at PrinSipa added, “Open-Silicon’s outstanding product offering, together with its professional and open culture, make it an ideal PrinSipa partner. Open-Silicon is a principal who is sure to be at the heart of our representational strategy and together, our mission is to evolve Open-Silicon into an indispensable SoC and ASIC technology partner to the UK and Ireland customer base.”

About Open-Silicon, Inc.

Open-Silicon, Inc. is a leading semiconductor company focused on setting new standards for predictable, reliable and flexible custom IC development. Open-Silicon provides leading-edge SoC and ASIC design, proven open market IP integration and high-quality silicon manufacturing services to customers worldwide. Through the MAX Technologies, Open-Silicon continues to introduce technology advantages in the areas of low-power design, high-performance processor implementation, variability management, and low-cost test that help customers increase their market success. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

About PrinSipa

PrinSipa is a semiconductor manufacturer’s representative covering the UK and Ireland offering advanced SoC manufacturers advanced sales development abilities. PrinSipa’s focus is on key OEM customers in the Storage, Consumer, Telecom and Industrial markets. Whether operating in close cooperation with the principal’s established OEM sales and distributor teams, or operating as a delegated direct sales force, PrinSipa has the market knowledge, sales drive and technical expertise to deliver quality added value to its principals and OEM customers alike. www.prinsipa.com

Open-Silicon Signs 150th ASIC Design Win

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Develop-to-spec ICs increase Open-Silicon’s portfolio

MILPITAS, Calif. - November 17, 2009: Open-Silicon, Inc., a leading ASIC design and semiconductor manufacturing company, announced today that it has reached the 150th design win milestone. The company has experienced an increasing demand for its develop-to-spec IC services over the past two years, and seen public companies increasingly embrace the company’s OpenMODEL™. In addition, Open-Silicon has opened an office in Japan to better address the company’s growing global demand.

Open-Silicon’s recent design wins have come from customers worldwide, including Canada, China, Europe, Israel, Japan, Singapore, and the United States. The company’s strong technology leadership with its MAX Technologies product line and innovative OpenMODEL has earned Open-Silicon global design wins across a wide range of industry segments—from wireless and mobile to storage and networking, security, and telecommunications. Also, increasingly semiconductor companies are contracting with Open-Silicon to take a specification and develop complete semiconductor products. For example, earlier this year Open-Silicon announced that the company successfully took NXP Semiconductor’s media processor from specification through production, including software, within 13 months.

Open-Silicon attributes much of its success to the OpenMODEL, the semiconductor industry's first spec-to-silicon SoC development solution based on a revolutionary business model that provides a seamless, low-cost, and low-risk alternative to traditional models for complex semiconductor design and development. The OpenMODEL offers the right choice of foundry, IP, package and test, that fits perfectly the need for each ASIC, based on performance, power, cost, schedule, application and market.

"The advent of Open-Silicon’s 150th design win is a true testament to our ability to deliver the most cost-effective, predictable and reliable custom SoC solutions,” said Dave Krishna, vice president worldwide sales at Open-Silicon. "The fact that customers of all sizes, market segments and geographies are seeking this flexibility validates that we have the right processes in place and have built the right relationships to ensure success for a large variety of customers.”

About Open-Silicon, Inc.

Open-Silicon, Inc. is a leading semiconductor company focused on setting new standards for predictable, reliable and flexible custom IC development. Open-Silicon provides leading-edge SoC and ASIC design, proven open market IP integration and high-quality silicon manufacturing services to customers worldwide. Through the MAX Technologies, Open-Silicon continues to introduce technology advantages in the areas of low-power design, high-performance processor implementation, variability management, and low-cost test that help customers increase their market success. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

Open-Silicon, MIPS Technologies, and Virage Logic Achieve High Performance ASIC Processor Design

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65nm Silicon Runs 1.1GHz Today; 40nm Target to Exceed 2.5GHz

MILPITAS, SUNNYVALE and FREMONT, Calif. – October 27, 2009: Open-Silicon, Inc., MIPS Technologies, Inc. (NASDAQ: MIPS), and Virage Logic (NASDAQ: VIRL) today announced the co-development of test chips showcasing the companies’ industry-leading technologies for building high-performance processor-based systems. The companies achieved successful 65 nanometer (nm) silicon testing of a processor test chip at 1.1GHz, making it one of the fastest processors built in a 65nm ASIC. Also, work has begun on a follow-on 40nm device targeting frequencies in excess of 2.5GHz and providing over 5000 DMIPS of performance. Both efforts utilize Open-Silicon’s CoreMAX™ technology as well as the superscalar MIPS32® 74K® processor core, a fully synthesizable processor core widely used in high-end digital consumer devices, set top boxes, and networking solutions.

The 65nm test chip 65nm test chipwas designed to show how the companies’ technologies can be used to achieve top performance in a standard ASIC implementation. The 74K processor core is complemented with 32KB L1 instruction and data caches, a 512KB L2 cache, and system and memory controller blocks, and was implemented using TSMC’s 65nm GP process with standard 10 track libraries and Virage Logic’s SiWare™ Memory compilers. The companies have working silicon running at 1.1GHz. To achieve this goal, Open-Silicon applied its patented CoreMAX performance enhancement technology to the design. This technology permitted the designers to build several hundred new standard cells targeted specifically at speeding up the design’s critical paths. This, along with the advanced SiWare Memory compilers and a triple Vt process option, allowed final design worst-case timing closure across all corners at 1.1GHz with standard ASIC margins.

“Open-Silicon was proud to work with our partners MIPS Technologies and Virage Logic to demonstrate our performance optimization technology,” stated Dr. Naveed Sherwani, CEO and president of Open-Silicon. “Open-Silicon’s CoreMAX has been used across more than 50 customer designs to gain an extra 10% of performance, giving them a competitive edge in their markets. It is a testament to the Open-Silicon technology to take a blazingly fast MIPS processor, use mainstream TSMC standard cell libraries, and achieve a new level of performance.”

“For more than a decade, Virage Logic’s embedded memories have been the IP of choice for high performance processor implementations,” said Dr. Alex Shubat, CEO and president of Virage Logic. “We are excited to serve as Open-Silicon’s and MIPS Technologies’ trusted IP partner and provide them with silicon-proven high speed memory technology that helps remove system bottlenecks and delivers the highest levels of performance possible.” The 40nm test chip in development is planned to reach silicon in the first quarter of 2010. The performance target is very high; frequencies above 2.5GHz are expected when selected from typical silicon, providing over 5000 DMIPS at top speeds. This test chip will include a floating point version of the 74K processor core, along with L2 cache, and system and memory controller blocks.

“MIPS Technologies has long been a performance leader in the processor IP industry, and we are continuing that tradition with these latest achievements,” said John Bourgoin, CEO and president of MIPS Technologies. “The 74K core is popular as the primary CPU in DTV, IPTV and cable set-top boxes, networking applications and other applications requiring high levels of performance. As we continue to push the performance bar with new technologies and through collaboration with industry leaders like Open-Silicon and Virage Logic, MIPS Technologies’ customers will enjoy the necessary processor headroom to support continued feature enhancement for years to come.”

About Open-Silicon, Inc.

Open-Silicon, Inc. is a leading semiconductor company focused on setting new standards for predictable, reliable and flexible custom IC development. Open-Silicon provides leading edge ASIC and SoC design, proven open market IP integration and high quality silicon manufacturing services to customers worldwide. Through the MAX Technologies, Open-Silicon continues to introduce technology advantages in the areas of low power design, high performance processor implementation, variability management, and low cost test that help customers increase their market success. In 2008, Open-Silicon was recognized by the GSA as the Most Respected Private Semiconductor Company. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

About MIPS Technologies, Inc.

MIPS Technologies, Inc. (NASDAQ: MIPS) is a leading provider of industry-standard processor architectures and cores that power some of the world's most popular products for the home entertainment, communications, networking and portable multimedia markets. These include broadband devices from Linksys, DTVs and digital consumer devices from Sony, DVD recordable devices from Pioneer, digital set-top boxes from Motorola, network routers from Cisco, 32-bit microcontrollers from Microchip Technology and laser printers from Hewlett-Packard. Founded in 1998, MIPS Technologies is headquartered in Sunnyvale, California, with offices worldwide. For more information, contact (408) 530-5000 or visit www.mips.com.

About Virage Logic

Virage Logic is a leading provider of both functional and physical semiconductor intellectual property (IP) for the design of complex integrated circuits. The company's highly differentiated product portfolio includes processor centric solutions, interface IP solutions, embedded SRAMs and NVMs, embedded memory test and repair, logic libraries, and memory development software. As the industry's trusted semiconductor IP partner, more than 350 foundry, IDM and fabless customers rely on Virage Logic to achieve higher performance, lower power, higher density and optimal yield, as well as shorten time-to-market and time-to-volume. For further information, visit http://www.viragelogic.com.

CoreMAX is a trademark of Open-Silicon, Inc. MIPS, MIPS32 and 74K are trademarks or registered trademarks in the United States and other countries of MIPS Technologies, Inc. SiWare Memory is a trademark of Virage Logic Corporation. All other trademarks referred to herein are the property of their respective owners.

Open-Silicon Enables Solarflare’s Low Power 10Gb Ethernet Solutions

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MILPITAS, CA – October 20, 2009: Open-Silicon, Inc., a leading developer of custom ASICs and SoCs, announced today that Solarflare Communications, the leader in 10 Gigabit Ethernet (10GbE) silicon, is using Open Silicon’s PowerMAX™ technology in its second-generation SFC9020 Ethernet Controller with integrated 10Gb Ethernet PHY, which has been sampling to Tier1 server OEMs. This is the third generation of Solarflare silicon built by Open-Silicon, and the second designed using Open-Silicon’s PowerMAX technology to optimize the silicon for low power.

Solarflare offers state-of-the-art 10GBASE-T performance with industry-leading low power, achieved by a best-in-class architecture, PHY integration, and Open-Silicon’s PowerMAXTM technology. The SFC9000 family can be used in most 10GbE applications, including LAN-on-motherboard, embedded adapters, blade mezzanine cards, and PCIe adapters. Solarflare’s product includes integrated SR-IOV, PCIe 2.0, and an integrated 10Gb SerDes requiring advanced 65nm design methodology to optimize the physical design for low power.

Open-Silicon’s PowerMAX technology offers low-power design techniques like multi-voltage, multi-channel length, and multi-Vt design. In addition, Open-Silicon offers custom techniques like back biasing, transistor transformations, and power recovery. The combination of the best low-power EDA design flows with Open-Silicon’s unique technologies allows building the best possible custom silicon.

“Solarflare’s 10Gb Ethernet products address the industry need for network convergence by offering support for networking, iSCSI, and FCoE traffic through a common portal,” said Danny Shamlou, senior vice president engineering of Solarflare. “Equally important is our focus on power efficiency. By partnering with Open-Silicon, we were able to build the lowest power solution in the industry, consuming less than half the power of the leading competitors’ products.”

“Open-Silicon offers a wide range of best-in-class engineering solutions to meet our customers’ various needs,” stated Dr. Naveed Sherwani, CEO and president of Open-Silicon. “Working with Solarflare has been a great experience and we are pleased that we have enabled them to set a new standard for low-power Ethernet solutions.”

About Open-Silicon, Inc.

Open-Silicon, Inc. is a leading semiconductor company focused on setting new standards for predictable, reliable and flexible custom IC development. Open-Silicon provides leading-edge SoC design, proven open market IP integration and high-quality silicon manufacturing services to customers worldwide. Through the MAX Technologies, Open-Silicon continues to introduce technology advantages in the areas of low-power design, high-performance processor implementation, variability management, and low-cost test that help customers increase their market success. In 2008, Open-Silicon was recognized by the GSA as the Most Respected Private Semiconductor Company. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

About Solarflare Communications, Inc.

Solarflare Communications is a semiconductor company delivering the next level of high-performance 10 Gigabit Ethernet (10GbE). As the leading provider of standards-compliant 10GbE silicon, Solarflare’s robust and power-efficient solutions are cost effective and easy to deploy. Ready for primetime, Solarflare 10GbEmakes possible next-generation applications such cloud computing, server virtualization, network convergence and low-latency networking (with Open Onload™) for market data applications. The privately held company is headquartered in Irvine, California, with a development center in Cambridge, UK, and has announced relationships with Accton, Citrix, CommScope, Delta Networks Inc., Panduit, SMC Networks and VMware.

Open-Silicon Achieves ISO 9001:2008 Certification

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MILPITAS, CA – June 25, 2009: Open-Silicon, Inc., a leading open market semiconductor manufacturer and provider of spec-to-silicon System-on-Chip (SoC) design services, today announced that the company was recently certified for the ISO 9001:2008 standard as part of their overall strategic plan for implementing best business practices and procedures. ISO 9000 is a family of standards for Quality Management Systems that was updated to ISO 9001:2008 on November 15, 2008.

“Quality is the foundation of our business. By certifying to the newest version of the ISO standards, we are confident that our processes are of the highest quality and that the continual improvement process to our systems is automatically implemented,” said Dr. Shafy Eltoukhy, vice president of manufacturing operations. “This adherence to quality translates to excellence in our SoC services and products that deliver on our promise of reduced design and development times, reduced costs and improved product reliability and performance.”

The International Organization for Standards (ISO) is the largest standards organization in the world, with a network of standards institutes from 159 countries. The ISO 9001 is a set of procedures covering all key processes within a business and ensures that these processes are efficient, effective and are monitored consistently allowing the company to continuously improve on its processes.

About Open-Silicon

Open-Silicon, Inc. is a leading semiconductor company focused on setting new standards for predictable, reliable and flexible custom IC development. Open-Silicon provides leading edge SoC design, proven open market IP integration and high quality silicon manufacturing services to customers worldwide. Through the MAX Technologies, Open-Silicon continues to introduce technology advantages in the areas of low power design, high performance processor implementation, variability management, and low cost test that help customers increase their market success. In 2008, Open-Silicon was recognized by the GSA as the Most Respected Private Semiconductor Company. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

Open-Silicon, Inc. Executes NXP Product Development in Record Time

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MILPITAS, CA —May 12, 2009: Open-Silicon, Inc., the leading open market semiconductor manufacturer and provider of spec-to-silicon ASIC design services, today announced successful completion of the software development phase of a custom ASIC device developed for NXP Semiconductors. Open-Silicon took the design from specification through production, including software, within 13 months.

The NXP device, a media processor SoC implemented in a 90nm low-power process, employed NXP IP and both Open-Silicon and NXP-specific design methodology. The Open-Silicon development team started with an architectural specification of the chip and designed verification boards and driver software, along with the hardware evaluation platform. The complex SoC was implemented through the Open-Silicon ASIC design methodology, a time-proven, repeatable process based on an established scientific approach that ensures cost-effective ASICs with on-time schedules and successful “first silicon” results.

“Our proven processes build in predictability and reliability, allowing us to successfully create this complex design from RTL through software and board development to production in record time,” said Taher Madraswala, Sr. Director, ASIC program management. “Additionally, our project management infrastructure, which includes ASICView™ software, allowed all hardware and software team members to view the project in real time and coordinate all deliverables on this complex project.”

“We selected Open-Silicon to complete this important project because of the proven Open-Silicon design and production methodology,” said Marcel Walgering, general manager of Media Processing, NXP Semiconductors. “Open-Silicon has both the technical expertise and the processes in place to successfully deliver repeatable results with very fast design cycles, allowing NXP to address market demand for this product with a fast time to market.”

About Open-Silicon

Open-Silicon, Inc. is a fabless ASIC company that was founded to set new standards for the predictability and reliability of ASICs and enable customers to differentiate their products through affordable custom silicon. Open-Silicon provides leading edge ASIC design, open market IP integration, and high quality silicon manufacturing services to customers worldwide. Through the “Science of ASICs” initiative Open-Silicon continues to introduce technology advantages that help customers increase their market success. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.


Open-Silicon Expands in India/Taiwan and Appoints Industry Veteran as COO

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May 6, 2009 - BANGALORE, INDIA: Open-Silicon, Inc., the leading open market semiconductor manufacturer and provider of spec-to-silicon ASIC design services, today announced the hiring of Shrikrishna Gokhale as COO of the company and managing director for its rapidly expanding India operations. He will be taking up this assignment by mid-May.

"Our business continues to grow at a significant pace which supports our growth plans for our India operation," said Dr. Naveed Sherwani, CEO and president of Open-Silicon. "Mr. Gokhale was selected because of his experience in driving and managing fast business growth through multi-national teams while remaining focused on customer support. His technical experience and semiconductor product development including VLSI design, device architecture and embedded software, combined with specific strengths in key markets such as communications and consumer electronics, will help us further establish our leadership in complex ASIC development."

Gokhale has over 28 years' experience in business management and technology development with Sasken, Philips and others. He has successfully managed multi-site teams of 600+ professionals spread across offshore, onsite and near-shore locations. In his previous positions, he handled various responsibilities including product development, business growth, resource planning and delivery management.

As COO and managing director, Gokhale will oversee Open-Silicon's day-to-day operations and will report directly to Dr. Sherwani.

About Open-Silicon, Inc.

Open-Silicon, Inc. is a fabless ASIC company that was founded to set new standards for the predictability and reliability of ASICs and enable customers to differentiate their products through affordable custom silicon. Open-Silicon provides leading edge ASIC design, open market IP integration, and high quality silicon manufacturing services to customers worldwide. Through the "Science of ASICs" initiative Open-Silicon continues to introduce technology advantages that help customers increase their market success. For more information, visit Open-Silicon's website at www.open-silicon.com or call 408-240-5700.

Open-Silicon, Inc. Introduces TestMAX

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MILPITAS, CA - May 1, 2009: Open-Silicon, Inc., the leading open market semiconductor manufacturer and provider of spec-to-silicon ASIC design services, today announced a new MAX technology focused on test engineering excellence. The patent pending TestMAX™ technology addresses test time reduction to lower device cost.

Design gate counts continue to grow exponentially, increasing both wafer probe and final test costs. Traditional scan testing frequencies are limited by the power dissipation in the device under test. By profiling the scan vectors for power dissipation, Open-Silicon is able to select those tests with lower thermal impact and power mesh currents and greatly increase their frequency. The net result is a significant reduction in test time, and therefore device cost.

“The ASIC industry often focuses on supply chain for cost reduction,” said Dr. Naveed Sherwani, CEO and president of Open-Silicon. “Open-Silicon’s MAX technologies are focused on making the best possible custom silicon, including design for lowest cost. Last year’s introduction of VariMAX™ enabled the highest manufacturing yields by managing process variability, and now TestMAX complements that by lowering device test costs.”

TestMAX’s scan shift frequency scaling technology won the SNUG best paper award in 2007.

About Open-Silicon

Open-Silicon, Inc. is a fabless ASIC company that was founded to set new standards for the predictability and reliability of ASICs and enable customers to differentiate their products through affordable custom silicon. Open-Silicon provides leading edge ASIC design, open market IP integration, and high quality silicon manufacturing services to customers worldwide. Through the “Science of ASICs” initiative Open-Silicon continues to introduce technology advantages that help customers increase their market success. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

Open-Silicon Ships More Than 40 Million Units to Customers

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MILPITAS, CA - April 29, 2009: Open-Silicon, Inc., the leading open market semiconductor manufacturer and provider of spec-to-silicon ASIC design services, today announced that the Company has achieved a milestone by shipping more than 40 million units.  This accomplishment was achieved in only the company’s sixth year of business, and fourth year of production shipments. Customers include Fortune 500 companies within the telecommunications, consumer, storage, and computing markets.

“Our ability to earn this high-volume business in high-growth applications is indicative of the success of our flexible ASIC model and our attention to quality,” said Dr. Shafy Eltoukhy, vice president of manufacturing operations. “By bringing together the highest level of customer service and support with MAX technologies and the OpenModel™, we develop the best possible silicon at any complexity level on time and cost effectively.”

The 40 million units represent a range of designs up to 30M gates with complex cores and multiple processors produced on processes from 0.25µm to 65nm from four different foundries. World foundry leader, TSMC, has produced the largest percentage of chips for Open-Silicon customers.

About Open-Silicon

Open-Silicon, Inc. is a fabless ASIC company that was founded to set new standards for the predictability and reliability of ASICs and enable customers to differentiate their products through affordable custom silicon. Open-Silicon provides leading edge ASIC design, open market IP integration, and high quality silicon manufacturing services to customers worldwide. Through the “Science of ASICs” initiative Open-Silicon continues to introduce technology advantages that help customers increase their market success. For more information, visit Open-Silicon’s website at www.open-silicon.com or call 408-240-5700.

Open-Silicon Inc. Secures $19.5 Million in Funding Semiconductor Industry Veterans Launch Company to Boost Chip Innovation

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SUNNYVALE, Calif.-March 29, 2004: Open-Silicon, Inc., a fabless semiconductor company providing a reliable, predictable and cost effective alternative to traditional chip design and supply chain models, today announced that it has closed two rounds of private equity financing bringing total capital investments to $19.5 million. (See related company announcement.)

Open-Silicon’s Series B funding came from prominent venture capital firms Norwest Venture Partners and Sequoia Capital, who co-led the company’s $8.5M Series A round in June 2003, and new investor, InterWest Partners. Net proceeds from all investments support continued research and development efforts and augment sales and marketing channels in North America and other strategic geographic locations.

“InterWest invests in world class teams that are first to market with dramatic changes for the industries we care about most," said Tom Rosch, general partner at InterWest Partners. Mr. Rosch joins Naveed Sherwani, CEO of Open-Silicon, Pierre Lamond, partner at Sequoia Capital, and Promod Haque, managing partner at Norwest Venture Partners, on Open-Silicon’s board of directors. “As a major investor in early-stage start-ups, we see fabless semiconductors—which have driven industries like the internet, DSL and wireless—as core engines of innovation. As we survey the fabless landscape, we have come to believe that rising development and execution costs are putting fabless innovation at risk. Open-Silicon and the OpenMODEL will play a major role in moving the fabless industry forward and continuing its track record of innovation.

About Open-Silicon’s Management Team
Open-Silicon was founded and is led by president and CEO, Dr. Naveed Sherwani, the former general manager and founder of Intel Microelectronics Services ®; vice president of operations, Scott Houghton, the former senior vice president and general manager of Synopsys Professional Services Group; and vice president of engineering, Dr. Satya Gupta, the former director of engineering for Intel Microelectronics Services. Sherwani, Houghton and Gupta each bring more than 16 years of ASIC and semiconductor sales, marketing, operations and international experience to the company.

About InterWest Partners
InterWest Partners (www.interwest.com), founded in 1979, is a leading diversified venture capital firm focused on building long-term relationships with entrepreneurs and portfolio companies. With $1.6B capital under management, and a current investment fund of $750 million, InterWest’s experienced partners bring together deep domain knowledge in Life Sciences and Information Technology.
InterWest Partners has consistently helped grow the most influential companies in Information Technology and Life Sciences. The firm's investments in Information Technology include: CIENA (CIEN), Copper Mountain Networks (CMTN), Crystal Semiconductor (acquired by Cirrus Logic, CRUS), Cyrix (CYRX; acquired by National Semiconductor), Lightera (acquired by CIENA), PlaceWare (acquired by Microsoft, MSFT), SiTera (acquired by Vitesse,VTSS), Silicon Graphics (SGI), Stratacom (acquired by Cisco, CSCO) and Xilinx (XLNX).
InterWest Partners has offices in Menlo Park, California and Dallas, Texas.

About Sequoia Capital
Since 1972, Sequoia Capital has provided startup venture capital for very smart people who want to turn ideas into companies. As the “Entrepreneurs Behind the Entrepreneurs”, Sequoia Capital's Partners have worked with innovators such as Sandy Lerner and Len Bozack of Cisco Systems, Jerry Yang and David Filo of Yahoo!, Gaurav Garg of Redback Networks, Larry Page and Sergey Brin of Google, Dan Warmenhoven of Network Appliance, Max Levchin and Peter Thiel of PayPal (eBay), T.J. Rodgers of Cypress Semiconductor, Lou Tomasetta of Vitesse Semiconductor, Steve Jobs of Apple Computer and Larry Ellison of Oracle. The companies organized by Sequoia Capital now account for about 10% of the value of NASDAQ. To learn more about Sequoia Capital visit http://www.sequoiacap.com/.

About Norwest Venture Partners
For more than 40 years, Norwest Venture Partners (NVP) has actively partnered with
entrepreneurs to build large businesses. NVP focuses on early stage investments in enterprise software and communications technologies. The firm currently manages more than $1.8 billion in venture capital out of its office in Palo Alto, California.
NVP has funded over 350 companies since inception including such market leaders as Actel Corporation, Brocade Communications, Cerent (acquired by Cisco Systems), Documentum, Extreme Networks, Forte Software (acquired by Sun Microsystems), NVE Corporation, PeopleSoft, Quantum Effect Devices (acquired by PMC-Sierra), RF MicroDevices, and Tivoli Systems (acquired by IBM). Recent NVP transactions include Resonext Communications (acquired by RF Micro Devices), Spinnaker Networks (acquired by Network Appliance) and Winphoria Networks (acquired by Motorola).
As a result of these and other investments, Managing Partner Promod Haque was recently named the #1 venture capitalist on the annual Forbes Midas List for 2004 based on performance over the past 10 years. Additional information on Norwest Venture Partners is available at www.nvp.com.

About Open-Silicon, Inc.
Open-Silicon, Inc. is a fabless ASIC company delivering the most cost-effective, predictable and reliable custom ASIC solution to electronics product customers worldwide. Open-Silicon’s OpenMODEL™ is the semiconductor industry's first end-to-end custom ASIC solution based on a revolutionary business model that provides a seamless, low-cost, low risk alternative to traditional models for complex ASIC design and development. For more information, visit Open-Silicon’s website at www.open-silicon.com.

MoSys Licenses 1T-SRAM-R Embedded Memory to Open-Silicon

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Delivers low power, superior reliability and ultimate density for high-performance ASIC applications using 0.13-micron standard logic process

SUNNYVALE, Calif.--(BUSINESS WIRE)--July 6, 2004-- MoSys, Inc. (Nasdaq:MOSY) the leading provider of high-density SoC embedded memory solutions and Open-Silicon, Inc., a fabless ASIC company that provides a predictable, reliable and cost effective alternative to traditional chip design and supply chain models, today announced the licensing of 1T-SRAM®-R™ embedded memory technology to Open-Silicon. MoSys' patented technology will enable Open-Silicon to provide its customers with high quality ASICs containing embedded memory, which will be fabricated in a standard logic process. The 1T-SRAM-R technology has been proven to dramatically reduce soft error rates (SERs) to fewer than 10 FIT/Mb in 0.13-micron process technology resulting in improved system-level reliability at a low cost while still maintaining the simple, industry-standard SRAM interface.

"MoSys' 1T-SRAM-R memory, including it's patented Transparent Error Correction™ (TEC™) technology, provides a valuable solution for embedding large high-performance, low-power memories cost-effectively into SoC designs," said Rajesh Shah, Director of Engineering and IP at Open-Silicon. "1T-SRAM-R memory technology in collaboration with our OpenMODEL™ concept addresses our customer's growing need to make intelligent and informed choices that lower cost and reduce risk at each step of the ASIC implementation."

Open-Silicon joins a long and growing list of world-class MoSys-licensed companies who are using 1T-SRAM-R in a wide range of applications that require cost savings combined with the highest levels of quality, reliability and low power.

"We are very pleased to add Open-Silicon to our list of leading companies that have licensed our 1T-SRAM memory technology," said Mark-Eric Jones, vice president and general manager of intellectual property at MoSys. "As the proportion of integrated circuit die area occupied by embedded memory continues to grow, selection of the correct memory technology becomes one of the key decisions for IC designers. By choosing our 1T-SRAM-R embedded memory, Open-Silicon and their customers will take advantage of the industry's highest quality, lowest cost, embedded memory solution."

ABOUT OPEN-SILICON
Open-Silicon, Inc. is a fabless ASIC company delivering the most cost-effective, predictable and reliable custom ASIC solution to electronics product customers worldwide. Open-Silicon's OpenMODEL™ is the semiconductor industry's first end-to-end custom ASIC solution based on a revolutionary business model that provides a seamless, low-cost, low risk alternative to traditional models for complex ASIC design and development. For more information, visit Open-Silicon's website at www.open-silicon.com.

ABOUT MOSYS
Founded in 1991, MoSys (Nasdaq:MOSY), develops, licenses and markets innovative memory technologies for semiconductors. MoSys' patented 1T-SRAM technologies offer a combination of high density, low power consumption, high speed and low cost unmatched by other available memory technologies. The single transistor bit cell used in 1T-SRAM technology results in the technology achieving much higher density than traditional four or six transistor SRAMs while using the same standard logic manufacturing processes. 1T-SRAM technologies also offer the familiar, refresh-free interface and high performance for random address access cycles associated with traditional SRAMs. In addition, this technology can reduce operating power consumption by a factor of four compared with traditional SRAM technology, contributing to making it an ideal technology for embedding large memories in System on Chip (SoC) designs. 1T-SRAM technology is in volume production both in SoC products at MoSys' licensees as well as in MoSys' standalone memories. MoSys is headquartered at 1020 Stewart Drive, Sunnyvale, California 94085. More information is available on MoSys' website at http://www.mosys.com.

Note for Editors:
1T-SRAM® is a MoSys trademark registered in the U.S. Patent and Trademark Office. All other trade, product, or service names referenced in this release may be trademarks or registered trademarks of their respective holders.

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